W71NW11GF1EW
- Manufacturer Winbond
- Part Number W71NW11GF1EW
- Description Multichip Packages 1G-bit 1.8V NAND + 1G-bit LPDDR2 MCP x16/x16
- Category Multichip Packages
Specifications
| Packaging | Tray |
| Min. Pack | 4,500 |
| Product Category | Multichip Packages |
| Data Bus Width | 16 bit |
| Subcategory | Memory & Data Storage |
| Series | W71NW11GF |
| Brand | Winbond |
| Mounting Style | SMD/SMT |
| Supply Voltage - Max | 1.95 V |
| Memory Size | 1 Gbit, 1 Gbit |
| Moisture Sensitive | Yes |
| Product Type | Multichip Packages |
| Minimum Operating Temperature | - 40 C |
| Organization | 64 M x 16 |
| Maximum Clock Frequency | 29 MHz, 533 MHz |
| Supply Voltage - Min | 1.14 V |
| Maximum Operating Temperature | + 85 C |
| Type | NAND Flash, LPDDR2 |
| RoHS | Y |
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