W71NW10GC3DW
- Manufacturer Winbond
- Part Number W71NW10GC3DW
- Description Multichip Packages 1G-bit 1.8V NAND + 512Mb LPDDR1 MCP x8/x32
- Category Multichip Packages
Specifications
| Packaging | Tray |
| Min. Pack | 2,500 |
| Product Category | Multichip Packages |
| Data Bus Width | 8 bit, 32 bit |
| Subcategory | Memory & Data Storage |
| Series | W71NW10GC |
| Brand | Winbond |
| Mounting Style | SMD/SMT |
| Supply Voltage - Max | 1.95 V |
| Memory Size | 1 Gbit, 512 Mbit |
| Moisture Sensitive | Yes |
| Product Type | Multichip Packages |
| Minimum Operating Temperature | - 40 C |
| Organization | 128 M x 8, 16 M x 32 |
| Maximum Clock Frequency | 29 MHz, 200 MHz |
| Supply Voltage - Min | 1.7 V |
| Maximum Operating Temperature | + 85 C |
| Type | NAND Flash, LPDDR1 |
| RoHS | Y |
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