DF33-2S-3.3C
- Manufacturer Hirose Connector
- Part Number DF33-2S-3.3C
- Description Board to Board & Mezzanine Connectors SOC HSG 2POS 3.3MM
- Category Board to Board & Mezzanine Connectors
Specifications
| Min. Pack | 1 |
| Product | Receptacles |
| Product Category | Board to Board & Mezzanine Connectors |
| Current Rating | 5 A |
| Minimum Operating Temperature | - 35 C |
| Voltage Rating | 500 V |
| Series | DF33C |
| Brand | Hirose Connector |
| Termination Style | Crimp |
| Mounting Angle | Straight |
| Subcategory | Board to Board & Mezzanine Connectors |
| Housing Material | Polyamide (PA) |
| Number of Rows | 1 Row |
| Insulation Resistance | 1000 MOhms |
| Product Type | Board to Board & Mezzanine Connectors |
| Contact Plating | Tin |
| Pitch | 3.3 mm |
| Contact Material | Copper Alloy |
| Maximum Operating Temperature | + 85 C |
| Number of Positions | 2 Position |
| RoHS | Y |
Need pricing on DF33-2S-3.3C?
Tell us your quantity and target price. We reply the same business day.